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Production Capabilities
PCBA Technologies
Prototyping Solutions
SMT Assembly
Conventional Assembly
Selective Soldering
Conformal Coating
3D AOI
X-Ray
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£5m Inventory
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Production
Capabilities
PCBA Technologies
SMT Assembly
Conventional PCBA Assembly
Prototyping & volume production quantities.
Latest Surface mount technologies to 01005 placement; BGA fine pitch technology.
Wave soldering and selective soldering capability
Full 3D AOI inspection plus the latest X-Ray inspection technology
Test & Device programming
Adherence to IPC-A-610 standards (Class 2 and Class 3)
Full Turnkey, complete product assembly, box build solutions
Wire loom, cable assembly solutions
Kanban, buffer, consignment stock, supply chain solutions.
Prototyping Solutions
From NPI and technical input through to product design and manufacturing processes
Conventional or SMT prototyping including BGA placement
We can advise customers on component selection at the NPI stage, concerning potential obsolescence, critical part, EOL and lead-time issues that may affect future parts availability.
SMT Assembly
Multiple latest Yamaha SMT machines: 01005 capability; up to 45,000cph; 180 feeder capacity per line.
DEK paste printers with Hawkeye technology to ensure accurate solder paste application.
Heller 1707 MK5 reflow ovens – featuring 7-zone heating profile.
Full SMT rework / prototype capabilities, BGA, QFN, QFP (BGA rework station has IR capability)
3D AOI
Conventional PCB Assembly
Wave soldering and hand soldering of through-hole components to IPC-A-610 standards
Selective Soldering
Jade MK2 selective solder machine.
Suits mixed technology PCBs, by eliminating costly wave or hand solder procedures.
Consistent quality assurance through precision-controlled solder application.
Conformal Coating
Delta 6 PVA robotic conformal coating/dispensing system with repeatability of 25 microns
Selective coating, potting, bead and meter-mix dispensing applications.
Conformal coating, Dam & Fill, potting, robotic gasketing and encapsulation applications
3D AOI
Full 3D inspection capability
Component verification, orientation, polarity, solder fillet, component leg lift, component height verification.
X-Ray
Latest Nordson Dage Quadra 3 X-Ray equipment
High magnification of range of potential manufacturing defects including: BGA, QFN, IGBT attachment, PTH filling, interfacial voiding, component cracking and counterfeit device screening.
